Aprašymas
FV modulis TCL HSM-ND66-GK715, nominali galia 715 Wp. Elementai: N tipo, dvipusis, sidabrinis rėmas, modulio naudingumas 23 % (STC). Gaminio garantija 15 metų, galios garantija: 87,4 % po 30 metų. Matmenys 2384 × 1303 × 33 mm (A × P × G), masė 38,5 kg.
Gamintojo informacija
High Energy Yield
• Lower temperature coefficient (Pmax): -0.29%/°C
• Up to 80% power bifaciality
Industry-leading G12 Wafer
• <1% degradation in the first year
• Smaller wafer chamfer, larger light receiving area
Superior Customer Value
• High module efficiency, Lower LCOE&BOS
Long-term Reliability
• Harsh environment resistance
• Damage-free laser cutting, lower micro-crack risk • Mechanical load: Front 5400 Pa, Back 2400 Pa